Mechanical Engineer

Key requirement:

• Experience driving Facility and Utility Integration decisions across product platforms.
• Experience with Cooling System Architecture, Heat Exchanger Selection, Chiller Sizing, Flow Balancing, Thermal Characterization, and Qualification Testing.
• Hands-on experience with MacroFlow or similar system-level flow and thermal network modeling tools.
• Working knowledge of Thermal Management, Cooling Systems, Equipment Facilitation, Utility Integration, and Fluid Distribution System Design for semiconductor equipment.

Role Responsibilities

• Own the design, development, qualification, and sustainment of mechanical systems, modules, and subsystems for Semiconductor Capital Equipment throughout the product lifecycle.
• Drive technical decisions, architecture trade-offs, and innovative design solutions to meet performance, reliability, safety, cost, schedule, and DFX objectives.
• Lead complex engineering problem-solving, root cause investigations, risk assessments, and implementation of corrective actions.
• Develop solutions for Thermal Management, Cooling Systems, Utility Integration, and other critical subsystem requirements.
• Collaborate with Systems, Electrical, Manufacturing, Supplier Engineering, and global engineering teams to deliver robust, scalable, and manufacturable designs.
• Drive product improvements, ECO/ECN implementation, reliability enhancements, cost optimization, and design standardization initiatives.
• Support supplier selection, component qualification, technology evaluations, and technical issue resolution.
• Create and maintain 3D CAD models, detailed drawings, specifications, BOMs, and engineering documentation.
• Define, execute, and document engineering validation, characterization, and qualification activities.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering or related discipline.
• 8+ years of experience in Mechanical Design and Product Development within the Semiconductor Equipment Industry or other complex capital equipment domains.
• Strong proficiency in Creo or equivalent 3D CAD tools.
• Strong understanding of GD&T, tolerance analysis, material selection, manufacturing processes, and engineering documentation practices.
• Experience with complete product development lifecycle, engineering analysis, design validation, risk assessment, engineering testing, and DFX methodologies.
• Working knowledge of Thermal Management, Cooling Systems, Equipment Facilitation, Utility Integration, and Fluid Distribution System Design for semiconductor equipment.
• Strong communication, presentation, articulation, and stakeholder management skills, with the ability to proactively identify and escalate risks, influence decisions, drive technical discussions, and collaborate effectively across global cross-functional teams.
• Demonstrated ability to independently solve complex engineering challenges and drive technical solutions with minimal supervision.

Preferred Qualifications

• Masters degree or bachelor’s in mechanical engineering or related discipline.
• Experience in Semiconductor Equipment Manufacturing, subsystems, or related semiconductor capital equipment.
• Experience with Cooling System Architecture, Heat Exchanger Selection, Chiller Sizing, Flow Balancing, Thermal Characterization, and Qualification Testing.
• Hands-on experience with MacroFlow or similar system-level flow and thermal network modeling tools.
• Knowledge of FEA, CFD, Vibration Analysis, Reliability Engineering, and advanced simulation methodologies.
• Experience driving Facility and Utility Integration decisions across product platforms.
• Experience working with global engineering teams, supplier engagement, product transfer, and component qualification activities.
• Experience leveraging AI-Powered Engineering and Productivity Tools to improve design efficiency, problem-solving, data analysis, documentation, and engineering decision-making.