Technical Lead- BSP, Hypervisior, Kernal, Boot Loader

Position: Technical Lead- BSP, Hypervisior, Kernal, Boot Loader (TK712FT RM 4430)

MANDATORY SKILLS : Automotive, Defect Ananlysis, Bug Fixing, BSP, Kernal, HyperV, Boot Loader

Role Overview

This role is for an Automotive BSP Engineer with strong hands-on experience in BSP, Kernel, Hypervisor, and Bootloader development. The candidate should be able to work on low-level platform software, board bring-up, debugging, integration, and issue resolution for automotive embedded systems. Experience in Linux, QNX, or Android-based automotive platforms will be preferred.

Key Responsibilities

• Work on BSP, Kernel, Hypervisor, and Bootloader development activities for automotive platforms.
• Support board bring-up, software flashing, system boot, and platform integration activities.
• Develop, debug, and integrate low-level software components, device drivers, and platform interfaces.
• Analyze and resolve issues related to kernel, bootloader, hypervisor, drivers, and board-level software.
• Work closely with internal teams, customer teams, and system integration teams for technical issue resolution.
• Maintain requirement updates, defect tracking, and technical documentation as per project needs.
• Participate in technical discussions, sprint planning, reviews, and customer calls related to BSP/platform software.
  
  

Required Technical Skills

• 7 to 12 years of experience in automotive embedded software development.
• Strong hands-on experience in BSP development and board bring-up.
• Good knowledge of Kernel development, configuration, debugging, and platform integration.
• Experience in Bootloader development, flashing, boot sequence analysis, and boot issue debugging.
• Working knowledge of Hypervisor concepts, integration, and debugging in automotive platforms.
• Experience in low-level device drivers and interfaces such as I2C, SPI, UART, CAN, GPIO, and Ethernet.
• Exposure to Linux, QNX, or Android/AOSP-based automotive platform software.
• Good debugging and root-cause analysis skills for board-level and platform-level issues.
• Automotive domain experience in infotainment, cockpit, telematics, ADAS, or connected vehicle platforms is preferred.
• Experience in requirement tracking, defect management, Agile execution, and technical documentation.
  
  

Preferred SoC / Platform Exposure

• Qualcomm Snapdragon Automotive platforms: SA8155P, SA8295P, SA8775P, SA8650P, SA8620P, SA8255P, SA7255P.
• Qualcomm embedded/edge AI platforms: QCS6490, QCS8250, QCS8550, QRB5165.
• Samsung Exynos Auto platforms: Exynos Auto V9, Exynos Auto V7, Exynos Auto T5123.
• Additional relevant SoC exposure: Snapdragon Cockpit, Snapdragon Ride, Qualcomm Automotive Development Platform, Samsung Exynos-based automotive or embedded platforms.