STA signoff

 Responsibilities

• Lead block-level and full-chip STA signoff for HBM products across all PVT corners.
• Own development and validation of SDC constraints, including clocks, generated clocks, false paths, multicycle paths, case analysis, and async constraints.
• Drive timing closure by analyzing and resolving setup/hold, recovery/removal, slew, fanout, and clock-related violations.
• Implement clocking solutions for complex HBM designs, including generated clocks, pulse clocks, and zero-cycle, single-cycle, and multi-cycle timing paths.
• Correlate STA results with simulation to improve signoff accuracy.
• Drive automation and productivity improvements using Tcl/Python for timing analysis, reporting, constraint generation, and debug workflows.
• Collaborate closely with Design, Verification, Layout teams to achieve successful tapeout and product qualification.
• Mentor engineers and provide technical leadership in STA methodology, timing closure, and signoff best practices.
• Capable of Characterizing Basic Standard Cells
• Lead technical reviews, risk assessments, and signoff readiness discussions for next-generation HBM products.
• Strong experience in STA signoff using PrimeTime or equivalent tools.
• Deep understanding of HBM/DRAM architectures and memory timing concepts.
• Expertise in SDC development, clock modeling, OCV/AOCV/POCV, and timing closure.
• Strong Tcl/Python scripting and automation skills.
• Experience with full-chip timing signoff for complex SoC or memory products.
• Proven record of technical leadership, innovation, and mentoring.
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Required Qualifications

• Education Qualification : BE or MTECH with 5+ Years of experience
• Minimum 6+ yrs of hands-on experience in STA signoff.
• strong communication skills
• Cross site & cross geo interaction