SPE Signal Integrity Professional
Rambus Chip Technologies · Bengaluru · onsite · Posted 63d ago
Undisclosed12–15 yrsfulltimeSourced from
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About this role
Job Summary
Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.
Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Senior Principal Engineer with signal integrity and package design experience to join our Memory Interface Chips BU s engineering team in Bangalore, India. In this highly visible role, you will work within our SI/PI team to work on modeling, analysis, and simulations of signal integrity (SI) and power integrity (PI) in the very challenging DDR field.
Responsibilities - Create SI/PI methodologies and work with the design chip layout teams to do SI/PI study and package design for the latest DDR product portfolio
- Work with package and validation team to define specifications and system design requirements such as packaging and PCB routings, IC-PKG-BRD decoupling requirements, channel simulations and jitter sensitivity analysis.
- Provide guidelines based on SI/PI study and simulation and silicon correlation so that our products will have superior SI performance.
- Work with our customers to do collaboration to find the optimum SI/PI solution.
- Help the team during debug and bring up in lab if needed.
- Solid background in SI/PI and package design.
- BE or MS or MTech in Electrical Engineering with 12+ years of industry experience.
- Prior experience in simulating high speed memory (DDR4, DDR5) and/or SERDES interfaces is required.
- Solid theoretical background and understanding in EM and transmission line theory is a must
- Strong background and solid understanding of equalization techniques such as FIR/FFE/DFE/CTLE are required
- Must understand package and PCB design, be able to use APD/Allegro layout files.
- On-Die PDN design exposure is big plus.
- Experience in correlating simulation results with lab measurements using scopes, TDRs, VNAs etc.
- Strong understanding of the server system, from CPUs to DRAMs on DIMM modules, is highly desirable
- Proficient with simulations using Spice and ADS.
- Experience with commercial EDA tools such as HFSS, Q3D or equivalent tools is must.
- Familiarity with RedHawk/Totem or XcitePI is a strong plus.
- Must be an innovative, self-motivated individual, be able to manage and drive his projects, and must be a team player
Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.
Sourced from naukri
Skills
pcb designingSignal IntegritySimulationsemiconductorPackagingsiliconTransmission LinePackaging DesignSystem DesignRecruitment
About Rambus Chip Technologies
Rambus Chip Technologies
175
employees
Bangalore / Bengaluru, Karnataka
India
₹21.8L PA avg
Avg at Rambus Chip Technologies
About
Rambus Incorporated, founded in 1990, is an American technology licensing company known primarily for their development of RDRAM.
Industries
ArchitectureLightingSemiconductor
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