BENGALURU · FULLTIME
Soc Thermal Engineer
Qualcomm
Bengaluru · onsite · Posted 57d ago
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Undisclosed3–8 yrsfulltimeBengaluru
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Section · 01
About this role
Company: Qualcomm India Private Limited
Job Area: Engineering Group, Hardware Engineering
General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Minimum Qualifications - Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
- Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
- PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
- SOC Thermal analysis methodology development: encompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets.
- Developing strategies to predict and improve thermally constrained scores (AnTuTu/Geekbench) and also measure/tune it on post-Si platforms, including infrared imaging.
- Thermal measurement: The candidate will be responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance.
- Should possess strong analytical skills and mathematical modeling abilities.
- Provide thermal analysis throughout the SoC product development cycle to identify and mitigate thermal risks, including post-silicon validation and customer collaboration.
- Perform SoC-level thermal analysis to support architecture, product specifications, and Power-Performance-Area-Thermal optimization. Recommend thermal mitigation strategies.
- Develop advanced thermal methodologies, software tools, and scalable processes; collaborate with cross-functional teams to drive efficiency and achieve goals.
- Knowledge of SoC stackup is a must.
- Good knowledge of scripting in PERL/Python required; some exposure to Machine Learning algorithms/frameworks will be a plus.
- Need to have thorough knowledge of heat transfer mechanisms and CFD.
- Proficiency with state-of-the-art thermal analysis tools Ansys Icepak/Flotherm.
- Thermal Measurement will be a preferred skill.
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Section · 02
Skills
analytical thinkingHardware Engineeringmechanical systemsAnalogPerlElectronics EngineeringHeat Transfermathematical modelingPythonDigital TransformationAlgorithmsArchitectureProduct DevelopmentflothermMachine Learning
Section · Company
About Qualcomm
Qualcomm
Semiconductors
22k+
employees
1996
30 years old
San Diego,California
United States
About
Qualcomm invents breakthrough technologies that transform how the world connects, computes and communicates.
Industries
SemiconductorsHardware & Networking
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