Silicon Packaging Design Engineer

Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and professional growth.

• Drive the complete development of substrate designs, starting from initial concept through tapeout.
• Perform physical layout and routing of package designs, ensuring adherence to design requirements.
• Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
• Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
• Define and implement substrate design rules to meet product and manufacturing requirements.
• Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
• Integrate design documentation and collateral into the product lifecycle management system.
• Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.

• Diploma in Electronic/ Electrical Engineering or a related field.
• six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
• Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
• Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
• Familiarity with design for manufacturability (DFM) and quality assurance processes.
• Strong problem-solving skills with a disciplined approach to execution.

• Preferred experience into E-CAD tool.
• Effective communication skills to convey technical information and collaborate with cross-functional teams.
• A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
• Passion for driving innovation and contributing to complex engineering challenges.

College Grad

Shift 1 (India)

India, Bangalore

This role will require an on-site presence.