Signal Integrity and Power Integrity Engineer

Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description

• Looking for a motivated Signal Integrity and Power Integrity Engineer with 3–6 years of experience to support high-speed package and PCB design.
• The candidate will have a strong foundation in SI/PI analysis, modeling, and simulation, along with exposure to package and PCB design.
• Candidate will work closely with system-hardware and packaging teams to ensure robust high-speed performance and reliable power delivery across products.
  
  

Requirements/Qualifications

Education:

• MS/M.Tech in Electronics or equivalent.
  
  

Requirements

• 3–6 years of industry experience in Signal Integrity and Power Integrity for package and/or PCB designs.
• Strong understanding of PDN for Chip packaging/substrate and PCB. Hands-on experience with SI/PI tools such as Cadence Sigrity, ADS, Ansys SIwave/HFSS, HyperLynx.
• Ability to analyze S-parameters, impedance profiles, TDR results, and PDN frequency responses.
• Familiarity with package design basics.
  
  

Travel Time

0% - 25%

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