Senior Principal Engineer- SoC/Chip Lead
Renesas · Bengaluru · onsite · Posted 72d ago
Undisclosed10–16 yrsfulltimeSourced from
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About this role
- Own end-to-end technical leadership and execution of complex SoC programs from architecture through silicon production.
- Drive SoC planning, integration strategy, execution schedules, risk management, and tape-out readiness.
- Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging, and product engineering.
- Define chip-level architecture, integration requirements, performance targets, and power/area objectives.
- Drive technical decision-making and trade-off analysis across architecture, implementation, and product requirements.
- Oversee subsystem and IP integration, ensuring successful deployment of complex multi-domain SoCs.
- Partner with analog and SerDes teams to integrate high-speed interfaces and mixed-signal subsystems into the overall chip architecture.
- Lead design reviews, execution reviews, silicon readiness assessments, and post-silicon debug activities.
- Drive issue resolution across the development lifecycle and ensure successful first-pass silicon execution.
- Mentor senior engineers and provide technical leadership across multiple engineering organizations. Qualifications
- Bachelors, Masters, or Ph. D. in Electrical Engineering, Computer Engineering, or related discipline.
- 20+ years of semiconductor industry experience with substantial leadership responsibility.
- Proven experience as a Chip Lead, SoC Lead, Technical Program Lead, or equivalent role for large-scale ASIC/SoC products.
- Demonstrated success leading advanced-node SoCs, preferably at 3nm and/or 5nm technology nodes .
- Deep understanding of SoC architecture, integration methodologies, and full-chip development flows.
- Strong experience working across:
- RTL Design, Design Verification, Physical Design, DFT, Static Timing Analysis, Low-Power Design Methodologies and Silicon Bring-up and Productization.
- Experience managing complex schedules, technical dependencies, and cross-functional execution across global teams.
- Strong communication, stakeholder management, and engineering leadership skills.
Preferred Qualifications:
- Prior experience with:
- High-performance switching silicon
- Network-on-Chip (NoC) architectures
- Data movement and interconnect fabrics
- High-bandwidth memory-centric systems
- Complex multi-die or chiplet-based architectures
- Hands-on experience integrating:
- High-speed SerDes interfaces, Analog front-end (AFE) subsystems, Mixed-signal IPs and Advanced PHY technologies.
- Experience with high-bandwidth and low-latency interconnect technologies.
- Knowledge of packaging technologies and signal integrity considerations for high-speed systems.
- Experience in AI, HPC, networking, connectivity, data-center, or memory infrastructure products.
- Prior exposure to UALink, Ethernet switching, switch fabrics, or similar high-performance interconnect technologies is highly desirable.
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Sourced from naukri
Skills
Hpcphysical designcomputer engineeringFirmwareAnalogipsengineering leadershipdigital designNOCASICDesign VerificationDFTComputer NetworksLow-Power DesigndeploymentDebugelectrical engineeringNode.JsArchitectureArtificial Intelligence
About Renesas
Renesas
Bangalore / Bengaluru, Karnataka
India
₹30.6L PA avg
Avg at Renesas
About
Renesas is a leading semiconductor manufacturer, producing various types of microchips and striving to enhance the global chipmaking industry through innovation.
Industries
ManufacturingElectronics
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