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    Job · 13638171

    Qualcomm logo

    PWB Designer, Senior

    Qualcomm · Hyderabad · onsite · Posted 58d ago

    Undisclosed7–12 yrsfulltimeSourced fromNaukri

    About a minute. You'll make an account on the way through.

    About this role

    Company: Qualcomm India Private Limited
    Job Area: Engineering Services Group, Engineering Services Group > PWB Design
    Job Summary
    The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to provide PWB design solutions for a variety of design types. For example: Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X. Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals. Reference handset designs - 'form factor accurate' (FFA) circuit boards. These boards require mastery in digital processors, RF and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.
    Responsibilities
    • For example: Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X.
    • Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals.
    • Reference handset designs - 'form factor accurate' (FFA) circuit boards.
    • These boards require mastery in digital processors, RF and radio circuits as well as power control devices.
    • Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages.
    • Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT.
    • Specific tasks include daily use of PWB CAD design software to perform placement and routing activities to meet mechanical and electrical design constraints and requirements.
    • Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function as well as power and signal integrity requirements.
    • Creating fabrication and assembly drawings and working with internal teams and external suppliers to support PWB fabrication and assembly.
    • The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects.
    • Leadership skills are expected on all projects to help direct, capture, and interface with outside consultants.
    • The candidate is expected to have proficiency on Mentor Xpedition, Mentor PADS and Cadence Allegro PWB design software and is expected to have multiple years of experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.
    • Design experience: RF, Analog, High-speed digital circuits - DDR2, 3 4, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, ATE Platforms: 93K, uFlex and iFlex.
    • Expected to possess a strong understanding and demonstrated application of PWB design principles, practices and standards.
    • Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
    Minimum Qualifications
    • Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience.
    • OR High School diploma or equivalent and 7+ years of PCB layout handling or related work experience.
    • 6-9 years actively involved in PWB design for high-density electronics packaging.
    • 6-9 years experience in a PWB design role designing consumer-grade mobile phones utilizing latest generation processor chips.
    • Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
    Skills
    • Mentor Xpedition
    • Mentor PADS
    • Cadence Allegro PWB design software
    • PWB design
    • DFM
    • Valor
    • CAM350
    • EMI shielding cans
    • IDF/EMN file exchange

    Sourced from naukri

    Skills

    Engineering DesignIOTCadenceCadence AllegroAnalogHdmiCADlaminationcad designAssembly Processelectrical engineeringDigital CircuitsCommunication SkillsFabricationcomplianceElectrical DesignAssembly Drawings

    About Qualcomm

    Qualcomm logo

    Qualcomm

    Semiconductors

    22k+

    employees

    1996

    30 years old

    San Diego,California

    United States

    About

    Qualcomm invents breakthrough technologies that transform how the world connects, computes and communicates.

    Industries

    SemiconductorsHardware & Networking

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