Project Manager

Role Summary

We are seeking an experienced Project Manager to lead cross-functional programs across our

semiconductor design, fabrication, packaging, and test operations. The ideal candidate will drive

projects from concept through high-volume manufacturing (HVM), coordinating tightly with process engineering, equipment/fab operations, supply chain, and quality teams to deliver new products, process nodes, or capacity expansions on time, within budget, and to yield/quality targets.

Key Responsibilities

• Own end-to-end planning and execution of semiconductor projects, including new product

introduction (NPI), process transfer, yield improvement, and fab capacity/equipment installation

programs.

• Develop and maintain integrated project schedules, critical path analysis, and resource plans

across design, wafer fab, assembly/test, and supply chain functions.

• Coordinate with process, product, equipment, and reliability engineering teams to track

technical milestones such as tape-out, first silicon, qualification, and ramp-to-volume.

• Manage project budgets, capital expenditure (CapEx) tracking, and vendor/tooling procurement

timelines in partnership with finance and procurement.

• Identify, track, and mitigate risks related to yield, equipment downtime, material shortages, and

schedule slippage; escalate issues with clear recovery plans.

• Drive stakeholder communication through regular program reviews, status reports, and

executive dashboards (e.g., using Zoho Projects, MS Project, Smartsheet, or Jira).

• Partner with customers and/or foundry/vendors on program timelines, qualification

requirements, and delivery commitments.

• Lead post-project reviews and drive continuous improvement in project management processes,

tools, and templates.

Required Qualifications

• Master's degree in Electrical/Electronics Engineering, Materials Science, Industrial Engineering,

or related field.

• 3 - 7 years of project management experience in the semiconductor, microelectronics, or

related high-tech manufacturing industry.

• Strong understanding of semiconductor fabrication processes (front-end and/or back-end),

wafer fab operations, or IC packaging and test.

• Proven track record managing multi-disciplinary teams and complex, schedule-driven programs

with hard technical milestones.

• Proficiency with project management tools (MS Project, Smartsheet, Jira, Primavera) and

manufacturing/ERP systems (SAP, Oracle).

• Working knowledge of Design of Experiments (DOE), Statistical Process Control (SPC), and yield

analysis methodologies.

• Excellent communication and stakeholder management skills, with experience presenting to

senior leadership and customers.

• PMP, PgMP, or Six Sigma certification preferred.