Process Engineering

Role Overview

SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities

• Technology & Process Setup
• Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow.
• Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow.
• Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines.
• Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters.
• Develop & validate thermal profiles for new & existing PCB assemblies.
• Stencil Design & Validation.
• Conduct DOE & Process validation for new products and materials.
• Setup , Monitor & Control critical reflow parameters
  
  

(Zone temp., Conveyor Speed, Soak time, Peak temp.)

• New Model Readiness
• Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow)
• All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.
• Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints )
• Ensure proper solder paste reflow per component and PCB design requirements
• Ensure smooth technology transfer from development to production.
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.
• Quality Excellence
• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.
• Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.
• Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls
• Partner with Quality team to address customer returns, audits and escalations.
• Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc )
• Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment)
• Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions
• Operational Excellence & Cost Optimization
• Own cost of ownership and productivity improvement initiatives.
• Drive Cycle time and line balancing improvements.
• Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )
• To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow )
• To ensure compliance with ESD , Safety& IPC standards.
• Analyze process data , SPC reports to identify trends & improvement opportunities.
• Customer & Stakeholder Engagement
• Serve as a technical team member for customers on PCBA Soldering process topics.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.
  
  

Key Deliverables & KPI

• First Pass Yield
• Yield and Reliability Performance
• Productivity Improvement
• Cost Optimization
• Customer satisfaction and audit outcomes.
  
  

Education Qualifications

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)
• 10-12 years hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes )
• Experience in high volume manufacturing environment.
• Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )
• Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )
• Familiar with thermal profilers ( KIC , Datapaq , ECD etc )
• Deep Understanding of solder paste behaviour & thermal profiling
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )
• Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )
• Familiar with Lean manufacturing