PRINCIPAL R&D/PRODUCT DVL ENGINEER
TE Connectivity · Bengaluru · onsite · Posted 50d ago
Undisclosed10–15 yrsfulltimeSourced from
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About this role
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
Consumer, network, and data center applications are evolving at an exponential pace and TE Connectivity''s Data & Devices (D&D) business unit is at the heart of this continuously expanding connected world. We conceive, design, and manufacture with responsiveness and agility to meet today''s most demanding requirements. Our customers are building the devices and infrastructure that are fundamentally redefining information technology, and our products are engineered to push market boundaries and meet the ever-changing needs of a faster, more data-driven world.
As a Principal Engineer in the Power Integrity Center of Excellence (PI COE), you will lead advanced power integrity (PI) research, modeling, and validation for next-generation high-speed interconnects and chassis deployed in AI data centers and high-performance computing (HPC) environments. You will independently drive PI studies and design platforming spanning geometry analysis, simulation-driven optimization, and design validation.
In this role, you will explore emerging PI methodologies, conduct in-depth literature reviews, formulate structured research plans, and develop innovative engineering solutions including in technically ambiguous or undefined problem spaces. You will collaborate closely with mechanical, manufacturing, materials, and operations teams to champion the adoption of cutting-edge PI technologies.
As a recognized subject matter expert, you will oversee the full PI engineering lifecycle from initial analysis and modeling through design, simulation, prototype fabrication, and final validation. You will take on complex design challenges and leverage advanced simulation tools to consistently optimize designs for both performance and manufacturability.
Roles and Responsibilities:
Mandate Skills:
Technical Skills
Proficiency with PI analysis tools such as Keysight ADS, Ansys HFSS, or equivalent, along with 3D electromagnetic modeling tools and Vector Network Analyzer (VNA) test equipment
Solid understanding of electromagnetics, circuits and switching power supplies
Solid understanding of statistical analysis and AI/ML model training methodologies
Strong analytical capability to interpret simulation and laboratory data, identify root-cause issues, and develop actionable engineering solutions
Familiarity with materials science, manufacturing processes, and manufacturing inspection practices
Working knowledge of at least one programming language: MATLAB, Python, C++, VBA, or equivalent
Communication & Collaboration
Excellent verbal, written, and presentation skills with the ability to convey complex technical concepts clearly to diverse audiences
Proven ability to operate effectively in a global work environment, collaborating across geographies and time zones; fluency in English (verbal and written) required
Highly self-motivated, intellectually curious, and able to work independently with minimal supervision
Preferred Qualifications (Nice to Have)
Doctoral degree in Electrical Engineering or related discipline
Background in Six Sigma methodologies or other advanced data analytics frameworks
Experience in engineering project leadership, particularly within design, development, and manufacturing teams
Direct customer engagement experience, including design support and technical consultation
Design exposure to data center compute equipment such as servers, switches, routers, storage systems, antenna systems, or RF front-end modules
Job Overview
At TE Connectivity, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, more sustainable, and more connected world.
Business Unit Overview
Consumer, network, and data center applications are evolving at an exponential pace and TE Connectivity''s Data & Devices (D&D) business unit is at the heart of this continuously expanding connected world. We conceive, design, and manufacture with responsiveness and agility to meet today''s most demanding requirements. Our customers are building the devices and infrastructure that are fundamentally redefining information technology, and our products are engineered to push market boundaries and meet the ever-changing needs of a faster, more data-driven world.
Job Overview
As a Principal Engineer in the Power Integrity Center of Excellence (PI COE), you will lead advanced power integrity (PI) research, modeling, and validation for next-generation high-speed interconnects and chassis deployed in AI data centers and high-performance computing (HPC) environments. You will independently drive PI studies and design platforming spanning geometry analysis, simulation-driven optimization, and design validation.
In this role, you will explore emerging PI methodologies, conduct in-depth literature reviews, formulate structured research plans, and develop innovative engineering solutions including in technically ambiguous or undefined problem spaces. You will collaborate closely with mechanical, manufacturing, materials, and operations teams to champion the adoption of cutting-edge PI technologies.
As a recognized subject matter expert, you will oversee the full PI engineering lifecycle from initial analysis and modeling through design, simulation, prototype fabrication, and final validation. You will take on complex design challenges and leverage advanced simulation tools to consistently optimize designs for both performance and manufacturability.
Roles and Responsibilities:
Power Integrity Design & Simulation
Lead PI design, simulation, and validation for next-generation high-speed interconnects and chassis throughout the full product development cycle
Execute PI COE analysis workflows, including:
o Performing power integrity simulations for high-speed interconnect product development, selecting appropriate simulation methodologies and setups tailored to each interface
o Modeling connectors and chassis with careful consideration of manufacturing constraints and end-use application requirements
o Identifying PI challenges, formulating research plans, developing new enabling technologies, and disseminating findings to the broader engineering community
Advanced Testing & Methodology Development
Innovative testing methodologies to characterize key PI metrics (impedance, voltage ripple, droop, noise coupling)
Develop and apply AI and big data analytics for predictive PI modeling and performance optimization
Design Optimization & Collaboration
Optimize material selection and electromagnetic design to improve noise isolation, signal integrity, and high-frequency response characteristics
Partner with New Product Development (NPD) teams and industry collaborators to shape PI strategies, contribute to technology roadmaps, and influence next-generation product design directions
What Your Background Should Look Like
Lead PI design, simulation, and validation for next-generation high-speed interconnects and chassis throughout the full product development cycle
Execute PI COE analysis workflows, including:
o Performing power integrity simulations for high-speed interconnect product development, selecting appropriate simulation methodologies and setups tailored to each interface
o Modeling connectors and chassis with careful consideration of manufacturing constraints and end-use application requirements
o Identifying PI challenges, formulating research plans, developing new enabling technologies, and disseminating findings to the broader engineering community
Advanced Testing & Methodology Development
Innovative testing methodologies to characterize key PI metrics (impedance, voltage ripple, droop, noise coupling)
Develop and apply AI and big data analytics for predictive PI modeling and performance optimization
Design Optimization & Collaboration
Optimize material selection and electromagnetic design to improve noise isolation, signal integrity, and high-frequency response characteristics
Partner with New Product Development (NPD) teams and industry collaborators to shape PI strategies, contribute to technology roadmaps, and influence next-generation product design directions
What Your Background Should Look Like
Mandate Skills:
Bachelors degree in electrical engineering or a closely related field; equivalent practical experience considered
10+ years of hands-on experience in a power integrity engineering role
Doctoral degree is a strong plus
10+ years of hands-on experience in a power integrity engineering role
Doctoral degree is a strong plus
Technical Skills
Proficiency with PI analysis tools such as Keysight ADS, Ansys HFSS, or equivalent, along with 3D electromagnetic modeling tools and Vector Network Analyzer (VNA) test equipment
Solid understanding of electromagnetics, circuits and switching power supplies
Solid understanding of statistical analysis and AI/ML model training methodologies
Strong analytical capability to interpret simulation and laboratory data, identify root-cause issues, and develop actionable engineering solutions
Familiarity with materials science, manufacturing processes, and manufacturing inspection practices
Working knowledge of at least one programming language: MATLAB, Python, C++, VBA, or equivalent
Communication & Collaboration
Excellent verbal, written, and presentation skills with the ability to convey complex technical concepts clearly to diverse audiences
Proven ability to operate effectively in a global work environment, collaborating across geographies and time zones; fluency in English (verbal and written) required
Highly self-motivated, intellectually curious, and able to work independently with minimal supervision
Preferred Qualifications (Nice to Have)
Doctoral degree in Electrical Engineering or related discipline
Background in Six Sigma methodologies or other advanced data analytics frameworks
Experience in engineering project leadership, particularly within design, development, and manufacturing teams
Direct customer engagement experience, including design support and technical consultation
Design exposure to data center compute equipment such as servers, switches, routers, storage systems, antenna systems, or RF front-end modules
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Skills
Customer EngagementHpchigh performance computinganalysis toolsGeometryAnalyticshfssManufacturing ProcessesData Analyticselectrical engineeringLiteratureFabricationManufacturingInformation TechnologyBig DataArtificial Intelligence
About TE Connectivity

TE Connectivity
Electronics Manufacturing
1.2k+
employees
1941
85 years old
Bangalore / Bengaluru, Karnataka
India
About
TE Connectivity specializes in connectivity and sensing solutions, emphasizing sustainability and reliability to address the needs of various industries.
Industries
Electronics ManufacturingInternetTelecomElectronics
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