Physical Design Lead
Kinara · Bengaluru · onsite · Posted today
Undisclosed15–20 yrsfulltimeSourced from
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About this role
As a Physical Design Lead Engineer, you will serve as a key technical leader responsible for the end-to-end physical implementation of complex SoCs and IPs on advanced technology nodes. You will own large and challenging design partitions or drive critical top-level physical design activities, including floorplanning, place-and-route, timing closure, and signoff.
You will play a pivotal role in achieving ambitious power, performance, area (PPA), quality, and schedule goals while providing technical leadership, mentoring engineers, and driving methodology improvements across multiple projects.
Key Responsibilities - Lead and execute all aspects of physical design from RTL to GDSII, including synthesis, floorplanning, power planning, place and route, clock tree synthesis (CTS), timing closure, physical verification, and tapeout.
- Own the complete physical implementation of complex SoC partitions, subsystems, or top-level designs and drive closure to production-quality signoff.
- Perform and drive advanced static timing analysis (STA), multi-corner multi-mode (MCMM) optimization, timing ECO implementation, and signoff closure.
- Drive closure across power, performance, area, signal integrity (SI), electromigration (EM), IR-drop, reliability, and manufacturability targets.
- Develop and optimize physical design methodologies, automation frameworks, flows, and scripts to improve design quality, efficiency, and turnaround time.
- Analyze critical timing paths, congestion, routing, and power bottlenecks, and develop innovative solutions to achieve aggressive PPA goals.
- Collaborate closely with architecture, RTL design, verification, DFT, package, and technology teams to resolve implementation challenges and optimize overall product quality.
- Drive physical signoff activities including DRC, LVS, antenna checks, density closure, metal fill verification, and tapeout readiness reviews.
- Contribute to architecture and design reviews by providing implementation-driven feedback to improve PPA and physical feasibility.
- Evaluate and deploy new EDA tools, methodologies, and advanced implementation techniques.
- Implement advanced low-power design methodologies including clock gating, power gating, multi-voltage design, retention, isolation, and UPF/CPF-based flows.
- Mentor and guide engineers, providing technical leadership and fostering engineering excellence across teams.
- Generate comprehensive implementation reports, signoff documentation, and design reviews throughout the development cycle.
Required Qualifications
- Bachelors or Masters degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field.
- 15+ years of ASIC/SoC physical design experience with a proven record of successful tapeouts on advanced process technologies.
- Extensive hands-on experience in synthesis, floorplanning, place and route, timing analysis, physical verification, and signoff closure.
- Proven ability to independently drive block-level, subsystem-level, and top-level implementation of complex multi-million gate SoCs, including multi-processor architectures.
- Strong expertise in one or more of the following domains: Physical Design Implementation Synthesis Timing Analysis
- Deep understanding of MCMM timing closure methodologies, timing constraint development, ECO implementation, and signoff flows.
- Hands-on experience with industry-standard EDA tools, including: Cadence Innovus and Tempus Synopsys Fusion Compiler, ICC2, and PrimeTime Ansys RedHawk or equivalent EM/IR analysis tools
- Strong knowledge of physical signoff methodologies including DRC, LVS, antenna checks, density validation, and metal fill closure.
- Experience with signal integrity analysis, crosstalk mitigation, electromigration (EM), and IR-drop closure.
- Strong understanding of manufacturability requirements and Design for Manufacturability (DFM) principles.
- Proficiency in Tcl scripting and working knowledge of Python and/or Perl for automation, reporting, and flow development.
- Demonstrated ability to drive multiple implementation experiments and optimize designs against challenging PPA targets.
- Experience with advanced process nodes including 16nm FinFET and below; experience in 7nm, 5nm, or more advanced technologies is a plus.
- Hands-on experience with low-power design techniques including clock gating, power gating, multi-voltage implementation, retention, isolation, and UPF/CPF methodologies.
- Demonstrated technical leadership, mentorship, and ability to drive cross-functional initiatives.
- Excellent problem-solving, analytical, debugging, communication, and stakeholder management skills.
- Ability to thrive in a fast-paced, collaborative, and globally distributed engineering environment.
Preferred Qualifications
- Experience leading physical implementation and signoff for large-scale SoCs across multiple engineering sites.
- Experience developing organization-wide design methodologies, automation frameworks, and best practices.
- Strong understanding of advanced-node challenges including congestion management, variation-aware timing closure, power integrity, and reliability signoff.
- Experience evaluating and deploying next-generation EDA technologies and AI-assisted design optimization techniques.
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Skills
AutomationCadenceeda toolslvsInnovuscompilercomputer engineeringipsanalysis toolsASICDFTElectronics EngineeringLow-Power DesignEvent DrivendebuggingFinFETClock Tree Synthesiselectrical engineeringNode.JsArchitectureArtificial Intelligence
About Kinara
Kinara
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About
Kinara delivers unrivaled edge AI solutions to accelerate and optimize real-time decision-making by powering smart edge devices and gateways that demand responsive AI computing at high energy efficiency. The company focuses on innovative technologies that enhance performance and energy efficiency in AI applications. By providing comprehensive support and training, Kinara ensures customers can effectively utilize their products and solutions.
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AI InfrastructureArtificial Intelligence (AI)Computer VisionSemiconductorSoftware
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