PCB design engineer

Job Requirements

At Quest Global, it's not just what we do but how and why we do it that makes us different. With over 25 years as an engineering services provider, we believe in the power of doing things differently to make the impossible possible. Our people are driven by the desire to make the world a better place—to make a positive difference that contributes to a brighter future. We bring together technologies and industries, alongside the contributions of diverse individuals who are empowered by an intentional workplace culture, to solve problems better and faster.

Senior PCB Design & Layout Engineer

Experience: 6–10 Years | Location: Bangalore, India | Domain: Automotive / Aerospace / IoT

About The Role

We are seeking an experienced Senior PCB Design & Layout Engineer with deep expertise in high-speed, multi-layer PCB design for Automotive, Aerospace, and IoT applications. The ideal candidate has hands-on mastery of complex layout challenges — DDR routing, controlled impedance, EMI mitigation, and power integrity — and can own the PCB design process from schematic capture through Gerber release and DFM sign-off.

Key Responsibilities

PCB Layout & Stack-up Design

• Design and execute 6–16 layer high-speed PCB layouts for embedded compute, ECU, telematics, avionics, and IoT platforms.
• Define and optimize PCB stack-up for controlled impedance (50Ω single-ended, 90/100Ω differential) in coordination with PCB fabricators.
• Perform component placement with strong emphasis on signal flow, thermal management, and EMI containment zones.
• Route high-density, multi-layer boards with blind and buried vias; apply via-in-pad where required for BGA fanout.
• Ensure DFM (Design for Manufacturability) and DFT (Design for Test) compliance throughout the layout process.
  
  

High-Speed DDR & Interface Routing

• Route DDR3/DDR4/LPDDR4 interfaces using fly-by and T-topology topologies with strict length matching and skew tuning per JEDEC specifications.
• Implement PCIe (Gen 1/2/3), USB 3.x, MIPI-CSI/DSI, HDMI, and Gigabit Ethernet high-speed differential pair routing with matched reference planes.
• Perform pre-layout and post-layout SI simulations using HyperLynx or equivalent tools; validate eye diagrams and ensure timing margin compliance.
• Apply best practices for via transitions, reference plane continuity, and decoupling capacitor placement for high-speed interfaces.
• Route Automotive interfaces — CAN, LIN, FlexRay, Automotive Ethernet (100BASE-T1/1000BASE-T1) — with appropriate termination and isolation.
  
  

Power Integrity & Distribution Network (PDN)

• Design robust power distribution networks with appropriate decoupling strategies, copper pours, and via stitching for low-impedance power delivery.
• Route DC-DC switching converters and LDO regulators with attention to switching node containment, feedback loop routing, and thermal pad design.
• Conduct PDN analysis to verify impedance targets; place bulk and high-frequency decoupling capacitors optimally.
• Implement load-dump protection, surge suppression, and in-rush current limiting circuits at the layout level.
  
  

EMI/EMC Layout Practices

• Apply EMI mitigation techniques at layout stage: solid return planes, stitching vias, guard traces, slot avoidance, and proper partitioning of noisy and quiet zones.
• Place and route EMI filters, ferrite beads, TVS diodes, and common-mode chokes correctly to ensure effective suppression.
• Support pre-compliance EMI testing using near-field probes; iterate board layout to address identified emission hotspots.
• Ensure connector and I/O zone layout complies with CISPR-25, ISO-11452, or MIL-STD-461 test requirements.
  
  

Schematic & Design Documentation

• Create and review schematics using Altium Designer.
• Develop and maintain PCB footprints, symbols, and component libraries to IPC-7351 land pattern standards.
• Generate complete fabrication and assembly packages: Gerbers (ODB++), drill files, BOM, assembly drawings, and fabrication notes.
• Conduct thorough design reviews (DRC, ERC, SI/PI checks) and collaborate with cross-functional teams for design sign-off.
  
  

Bring-up & Test Support

• Support board bring-up activities: power rail verification, multi-rail sequencing checks, and debug using oscilloscopes (GHz bandwidth) and logic analyzers.
• Troubleshoot layout-related failures during bring-up; perform rework and ECO implementation.
• Provide ICT/FCT/Flying-Probe test point planning at layout stage; assist test engineers with coverage strategies.
• Use protocol analyzers (I2C, SPI, UART, CAN) for functional validation of hardware interfaces.
  
  

Required Skills & Qualifications

Experience & Education

• 10+ years of hands-on PCB layout experience with at least 4 years on high-speed, multi-layer boards (8+ layers).
• B.E./B.Tech in Electronics, Electrical Engineering, or a related discipline.
• Portfolio of completed PCB designs spanning multiple domains (Automotive/Aerospace/IoT preferred).
  
  

EDA Tools

• Proficient in at least one major EDA suite: Altium Designer.
  
  

PCB Layout Expertise

• DDR3/DDR4/LPDDR4 routing — fly-by topology, T-topology, length matching, and skew tuning.
• High-speed differential pairs: PCIe, USB3, MIPI-CSI/DSI, HDMI, Ethernet.
• BGA fanout strategies, via-in-pad, blind/buried vias, and back-drill.
• Controlled impedance design and stack-up planning.
• Power plane design, copper pour, stitching vias, and PDN optimization.
• EMI suppression at layout level: return path integrity, slot-free planes, partitioning.
• DFM/DFT: IPC-2221/2222 compliance, test point placement, solder mask and silkscreen standards.
  
  

Standards & Compliance

• IPC-2221, IPC-2222, IPC-7351 (land pattern standards).
• CISPR-25 / ISO-11452 for Automotive EMC, or MIL-STD-461 for Aerospace.
• Awareness of ISO-26262 (ASIL) hardware safety requirements; DO-254 exposure is a plus.
• JEDEC standards for DDR memory interface layout.
  
  

Good to Have

• Experience with ARINC-429 or ARINC-818 interface layout for avionics boards.
• Exposure to MIPI-CSI camera module integration and ISP board design.
• Familiarity with RF/antenna placement, matching network routing for Wi-Fi, BLE, LTE, GPS modules.
• Knowledge of thermal simulation tools and heatsink/thermal via design for power components.
• Hands-on soldering and rework experience to support prototype bring-up.
• Exposure to ODB++ output generation and working with PCB fabrication/assembly vendors.
  
  

What We Offer

• Work on cutting-edge hardware platforms: ADAS compute boards, avionics recorders, telematics units, and embedded vision systems.
• End-to-end PCB design ownership — from blank canvas to production-ready boards.
• Collaborative team with strong hardware culture and rigorous design reviews.
• Competitive compensation; growth into hardware architecture and lead roles.
• Exposure to international customers and multi-domain projects (Automotive + Aerospace + IoT).
  
  

We are known for our extraordinary people who make the impossible possible every day. Questians are driven by hunger, humility, and aspiration. We believe that our company culture is the key to our ability to make a true difference in every industry we reach. Our teams regularly invest time and dedicated effort into internal culture work, ensuring that all voices are heard.

We wholeheartedly believe in the diversity of thought that comes with fostering a culture rooted in respect, where everyone belongs, is valued, and feels inspired to share their ideas. We know embracing our unique differences makes us better, and that solving the worlds hardest engineering problems requires diverse ideas, perspectives, and backgrounds. We shine the brightest when we tap into the many dimensions that thrive across over 21,000 difference-makers in our workplace.