Agent
Jobs
Applied
Tracker
Profile
    1. Jobs for you
    2. Job

    Job · 13975263

    TE Connectivity logo

    MGR II R&D/PRODUCT DVL ENGINEERING

    TE Connectivity · Bengaluru · onsite · Posted 57d ago

    Undisclosed12–17 yrsfulltimeSourced fromNaukri

    About a minute. You'll make an account on the way through.

    About this role

    At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.


    Job Overview
    As a Principal Signal Integrity Engineer, you will lead the electrical architecture, system-level design strategy, and advanced signal integrity solutions for high-speed interconnect platforms, including connectors, cable assemblies, and system interfaces. You will serve as the technical authority driving signal integrity methodologies, defining design standards, and influencing product roadmaps aligned with next-generation high-speed protocols. This role requires close collaboration with global cross-functional teams and direct engagement with key customers to solve complex system-level challenges. In addition, you will play a critical role in developing organizational capability by mentoring and training engineers, ensuring strong technical depth across the team.


    KEY RESPONSBILITIES:
    • Lead and perform advanced signal integrity simulation and analysis for high-speed interconnects, including connectors, cable assemblies, and PCB interfaces using EM and circuit simulation techniques.
      12+ years of relevant experience in signal integrity and high-speed design, including interconnect and/or system-level applications.
      Lead signal integrity design and optimization of connectors and cable assemblies to meet system-level performance requirements.
      Establish signal integrity performance and functional requirements for new product development.
      Review and guide PCB interface design (footprints, breakout, routing transitions) from a signal integrity perspective.
      Act as the technical authority for SI-related challenges across multiple connector and cable assembly programs.
      Drive technology roadmap alignment for high-speed interconnects with evolving industry requirements.
      Lead customer technical discussions focused on interconnect performance, integration, and optimization.
      Influence cross-functional decisions across mechanical design, materials, manufacturing, and system integration.
      Drive innovation and continuous improvement in interconnect SI design, modeling, and validation approaches.
      Lead and mentor engineers across regions to ensure consistency in methodologies, design quality, and technical execution.
      Deep expertise in signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent), with extensive hands-on experience in ADS circuit simulation, channel analysis, and optimization methodologies for high-speed interconnect systems.
      Strong experience with IBIS-AMI model simulation for SERDES channel performance evaluation, including advanced understanding of parameter tuning, equalization strategies, and BER/eye diagram analysis, with the ability to interpret results and guide system-level decisions.
      Expert-level understanding of electromagnetic theory and electrical circuit behavior, with practical experience working with high-speed active components such as DSPs, re-timers, and re-drivers, and their interaction within system-level signal paths.
      In-depth knowledge of eye diagram optimization and signal conditioning techniques, including CTLE, DFE, FFE, and emphasis settings, with the ability to analyze link margins and influence design trade-offs for performance improvement.
      Proven ability to interpret and guide eye diagram and link-level performance results from an interconnect perspective, including understanding the impact of equalization techniques (e.g., CTLE, DFE, FFE) on channel behavior in collaboration with system/ASIC teams.
      Demonstrated ability to define SI requirements and guide design decisions for new product development
      Experience in PCB interface design considerations.
      Demonstrated experience in mentoring, training, and guiding junior engineers in signal integrity and high-speed interconnect design


    DESIRED SKILLS"
    Bachelors or Masters degree in Electrical Engineering or a related field


    What your background should look like
    Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters degree with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent


    Competencies
    SET : Strategy, Execution, Talent (for managers)

    Sourced from naukri

    Skills

    Signal Integritysystem integrationAmiDesign StrategyASICElectrical CircuitHigh Speed DesignhfssCircuit Simulationelectrical engineeringMechanical DesignNew Product DevelopmentArchitectureManufacturingProduct Development

    About TE Connectivity

    TE Connectivity logo

    TE Connectivity

    Electronics Manufacturing

    1.2k+

    employees

    1941

    85 years old

    Bangalore / Bengaluru, Karnataka

    India

    About

    TE Connectivity specializes in connectivity and sensing solutions, emphasizing sustainability and reliability to address the needs of various industries.

    Industries

    Electronics ManufacturingInternetTelecomElectronics

    Employee ratings

    1,327 reviews

    4.1/ 5

    Culture

    4.2

    Career growth

    3.3

    Work-life

    4.1

    Employees rate it well for

    Work Culture157Work Life Balance134Salary113Senior Management99Work Environment94

    Find them on

    WebsiteLinkedInAmbitionBox reviews

    MGR II R&D/PRODUCT DVL ENGINEERING · waiting for your command