Lead Full-chip STA and timing signoff Engineer

Job Summary

Advance your career. Advance the world.

At AMD, we believe technology has the power to solve the world's most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we'll advance your career.

The Role

We are seeking an experienced Full Chip SoC Timing Lead in ASIC/SoC design implementation and timing closure. The ideal candidate will lead full-chip timing activities from synthesis through place-and-route, signoff, and tapeout for complex SoCs in advanced technology nodes. This role requires deep expertise in STA, timing constraints, MMMC flows, SI/crosstalk analysis, ECO closure, and cross-functional collaboration with RTL, PD, CTS, DFT, power, and signoff teams.

The Person

You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc. You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you.

Key Responsibilities

• Lead full-chip timing closure for complex SoC/ASIC designs across all modes and corners.
• Own and drive timing signoff from synthesis to final tapeout.
• Develop, validate, and maintain timing constraints including SDC for full-chip and block-level integration.
• Perform and review static timing analysis (STA) for setup, hold, recovery, removal, clock gating, and async paths.
• Drive MMMC timing methodology and ensure robust timing convergence across PVT corners.
• Work closely with physical design teams on floorplanning, placement, CTS, routing, and post-route timing optimization.
• Analyze and resolve timing violations related to datapath, clock path, cross-talk, noise, OCV/AOCV/POCV, derates, and variation effects.
• Lead timing ECO strategies and execute closure with minimal impact to power, area, and performance.
• Collaborate with RTL/design teams to identify architectural or logic changes required for timing improvement.
• Coordinate with IP/block owners for timing budgeting, interface timing closure, and hierarchical timing signoff.
• Ensure signoff quality using industry-standard tools and methodologies.
• Drive correlation between implementation timing and signoff timing.
• Lead tapeout readiness reviews and provide timing risk assessment to program leadership.
• Mentor junior engineers and define best practices for timing methodology and closure.

Preferred Experience

• Bachelor's or Master's degree in Electronics / Electrical Engineering / VLSI / Microelectronics / Computer Engineering.
• 12+ years of hands-on experience in ASIC/SoC timing analysis and timing closure.
• Strong expertise in full-chip STA and timing signoff for large-scale SoCs.
• Proven experience in advanced technology nodes (such as 7nm, 5nm, 3nm or similar).
• Strong knowledge of synthesis, place-and-route, extraction, and signoff flows.
• Experience with timing budgeting and hierarchical/full-chip integration.
• Solid understanding of clocking architecture, CDC implications, and timing exception handling.
• Ability to debug complex timing issues and drive closure under aggressive schedule targets.
• Strong communication, stakeholder management, and leadership skills.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.