Lead Engineer - PCB Design

What You'll Do

The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products

• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
• Able to lead Program with multiple PCBs and deliver with help of one or more resources
• Design complex multi-layer PCBs for:
• Data center power distribution and management systems
• Thermal management and cooling control systems
• Know-how of OCP Rack and its structure
• Hands-on experience in High Voltage, High Current PCBs
  
  

Develop PCB Solutions Considering

• Signal Integrity (SI)
• Power Integrity (PI)
• EMC/EMI compliance
• Thermal performance
• Reliability and Manufacturability
• Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
• Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
• Mentor PCB designers and provide technical leadership across global engineering teams.
  
  

Qualifications

Required: Bachelor's Degree in Electronics / Electronics and Communication / Electrical Engineering.

• 12–14 years of PCB design experience in power electronics or thermal management products.
  
  

Skills

• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.
  
  

Required:

Strong Experience In Below

• Experience with High Power, Flex, Rigid Flex & HDI PCBS.
• High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
• Power electronics and power conversion systems
• Creepage clearance and safety requirements
• SI/PI analysis and simulation
• Thermal-aware PCB design
• DFM, DFA, and DFT methodologies
  
  

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.

Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.

Able to do Power Integrity or Signal Integrity Simulations will be added advantage

Standards & Compliance: Strong working knowledge on below:

• IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
• Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH
  
  

Desired

• Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .
  
  

Special

• CAM validation, check and basic editing of Gerber data using CAM350.
  
  

• Strong leadership, communication, and problem-solving skills.
• Ability to work effectively in cross-functional and global engineering environments.