Lead Electronic Hardware Design Engineer

Lead Electronic Hardware Design Engineer

About the Role:

We are looking for a Lead Electronic Hardware Design Engineer to own the architecture and development of our product portfolio: EV chargers (EVSE), ticket validators, edge compute platforms and payment terminals. You will take hardware from concept to certified, production-ready product, work closely with firmware, mechanical and compliance teams, and mentor junior engineers.

EVSE | Ticket Validator | Edge Compute | Payment Hardware

Roles and Responsibilities

• Product Innovation: Conceptualize, research and design hardware for EVSE (AC and DC fast charging), ticket validators, edge compute devices and payment terminals.
• Technical Leadership: Mentor engineers, run design reviews, and set standards for design, documentation and testing.
• EVSE and Power Electronics: Design control, metering, protection and communication boards, including pilot/CCS/CHAdeMO interfaces, isolation, contactor control and insulation monitoring.
• Edge Compute and Connectivity: Design SoM/SoC-based boards with high-speed interfaces (DDR, USB, SATA, Ethernet, PCIe, MIPI), LTE/Wi-Fi/BLE/NFC/GNSS modules and low-noise analog front ends.
• Payment and Validator Hardware: Integrate card readers (contact, contactless, magstripe), secure elements, tamper-detection circuits, displays and barcode/QR/NFC readers, with secure interfaces to the host processor.
• Execution: Own schematic capture, PCB layout (high-speed, mixed-signal, power, RF), board bring-up, debugging, DFM/DFT and handover to manufacturing.
• Thermal Design and Validation: Design for thermal efficiency from the start. Validate real board behavior using thermal imaging, sensor logging and chamber/soak testing. Find hotspots and root causes, and fix them through layout, components, copper/vias, heatsinking, airflow, enclosure changes and derating. Drive thermal sign-off against component limits and certification temperature-rise requirements.
• Certification Ownership: Define the compliance plan for each product type and design for it from day one. Work with labs and ODMs through pre-compliance, testing, failure analysis and final approval.
• Documentation: Maintain schematics, BOMs, design calculations, test and thermal reports, risk files and certification dossiers.

Desired Candidate Profile

• Education: B.Tech, M.Tech or PhD in Electrical/Electronics Engineering, Computer Engineering or equivalent.
• Experience: Minimum 7 years of hands-on hardware design, including at least 2 shipped, certified products in the EV charging, payment or embedded/edge domain.
• Technical Foundation: Strong command of analog, digital, power and microcontroller/microprocessor design, and of high-speed and mixed-signal PCB layout.
• Thermal Expertise: Proven ability to measure, diagnose and fix thermal problems on high-power or enclosed products, and to deliver verified fixes.
• Tools: Altium, OrCAD, Cadence, KiCad or equivalent; signal-integrity and thermal simulation tools (Icepak, Flotherm or equivalent).
• Personal Attributes: Problem-solving mindset, attention to detail, disciplined documentation, and comfort working with external labs, ODMs and vendors.

Certification Experience

Hands-on experience in at least two of the areas below is required; more is preferred.

Product

Certifications and Standards

Thermal Requirements

EVSE (AC/DC)

UL 2594, UL 2202, UL 2231, IEC 61851-1/-23, IEC 62196, CE/FCC, BIS/AIS-138, IS 17017, OCPP and ISO 15118 conformance, metering regulations

Temperature-rise testing, connector/cable temperature limits, over-temperature protection

Ticket Validator

FCC/CE/BIS EMC and radio, NFC (ISO 14443, EMVCo L1 contactless), transit standards, GMS (via ODM) if Android-based, IP/IK ratings

Operating temperature range, sunload, touchable surface limits

Edge Compute

FCC/CE/BIS EMC, IEC 62368-1, PTCRB/GCF, WPC/TEC, ESD/surge, vibration

Thermal throttling behavior, sustained full-load testing

Payment Terminal

EMVCo L1 (contact and contactless), PCI PTS POI, PCI PIN, tamper resistance, secure boot and key injection, card-brand approvals

Operating temperature range, touchable surface limits

Key Skills

• Design: Digital/analog/power PCB design, board bring-up, RF and antenna integration, microcontrollers/microprocessors, AC-DC, DC-DC and PFC, isolation, creepage and clearance, EMC-aware layout.
• Interfaces: UART, SPI, I2C, CAN, RS-485, Modbus, USB, Ethernet, NFC/RFID, cellular/Wi-Fi/BLE.
• Thermal: Copper pours, thermal vias, TIMs, heatsinks, airflow, power loss estimation, junction temperature calculation, thermal simulation, IR imaging, thermocouples, chamber testing and derating.
• Testing: Oscilloscopes, logic analyzers, spectrum and power analyzers, EMC pre-compliance, HALT/HASS, DVT/PVT, FMEA.

Good to Have

• Experience with ODMs and contract manufacturers.
• Firmware/Linux bring-up and secure boot familiarity.
• Experience with US, EU and India certification labs.
• Thermal failure analysis, and passing temperature-rise tests within one or two attempts.