Interim Engineering Intern_2027_Hw
Qualcomm · Hyderabad · onsite · Posted 57d ago
Undisclosed3–5 yrsfulltimeSourced from
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About this role
Job Summary
Job Area: Interns Group, Interim Engineering Intern - HW
Responsibilities - SOC Hard Macro Physical Design
- SOC Validation Debug
- RF Analog Layout
- RF/Analog/Mixed Signal/Power IC Design
- Low Power Design
- Board and FPGA Design
- Digital ASIC Design
- Design/SOC Verification
- CAD Solution Engineer
- Design for Test (DFT)
- CPU Design
- Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
- Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
- Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
- Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
- Excellent analytical and problem solving skills.
- Ability to collaborate and work in teams.
- Good verbal and written communication skill
Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE
Sourced from naukri
Skills
FPGA DesignMixed SignalCadence5GAnalog layoutphysical designcmosAnalogAutomotivePerlProgrammingASICASIC DesignCADDFTComputer NetworksIC Designmobile technologyEmbedded SystemsDebugelectrical engineeringGraphics
About Qualcomm
Qualcomm
Semiconductors
22k+
employees
1996
30 years old
San Diego,California
United States
About
Qualcomm invents breakthrough technologies that transform how the world connects, computes and communicates.
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SemiconductorsHardware & Networking
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