IC Technology Development - Process & Packaging SME

About the Role:

As the Lead of Wire Bonding, you will be responsible for overseeing and leading the wire bonding operations within a semiconductor manufacturing facility. Your role involves managing the wire bonders, implementing process improvements, ensuring quality standards, and collaborating with other departments to achieve overall production goals.

Key Responsibilities:

• Handson experience in FOL or EOL process within semiconductor industry, with a proven track record of accomplishment.
• In-depth knowledge of any single /multiple process related to process and equipment.
• Set up and operate FOL or EOL equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to process or equipment, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with program manager and deliver reports on time.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.

Essential Attributes:

• Strong analytical and problem-solving skills.
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse.

Qualifications:

• Bachelor s degree in mechanical, Electronics or Electrical or Industrial engineer.

Desired Experience Level:

• Minimum 5 years of experience in semiconductor manufacturing.