IC Technology Development Material Characterisation Engineer

Responsibilities:

• Responsible for the development of materials required for OSAT Package Technology Development
• Expertise in understanding semiconductor package materials, equipment and processes and have an established wide network of suppliers and contacts in the industry.
• Need to work closely with development teams to develop the most profitable packaging solutions with right material selection.
• Evaluate and select materials for packaging, focusing on their compatibility with the packaging technology, while considering cost constraints.
• Knowledge and experience in managing die to package interactions.
• Drive cost reduction programs and yield improvement programs
• Identifying industry packaging trends, working with the Business Units to develop the required materials.
• Liaise with materials and equipment suppliers, understand and influence roadmaps and narrow down packaging solutions & drive competitive analysis.
• Able to quickly become acquainted with new topics and build lasting relationships with the Cross-functional teams and external counterparts.
• Knowledge in materials characterization and analysis
• General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Good program management skills.

Essential Attributes:

• Good understanding of Advanced Packaging architecture and semiconductor packaging process flow.
• Knowledge on Packaging Assembly Process (Back Grinding, Dicing, Die Attach, Wire Bonding, Moulding, P&P, Ball Attach, Trim & Form, Singulation).
• Ability to work well in a cross-functional environment on challenging projects.
• Experience in package material characteristics and interfacial bonding.
• Able to perform independent research and development work.
• Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.

Qualifications:

• Bachelor or Master Degree in chemical, Mechanical, or Materials Science Engineering.

Desired Experience Level:

• Minimum 5+ years of experience in semiconductor package simulations.