IC Technology Development Lead Frame/substrate design Manager

Responsibilities:

• Perform logical packaging design (interpreting and creating netlist, ball pad layout and routing rules from customer provided information packages and schematics).
• Perform substrate layout design & stack- up analysis (parts placement, line/space routing, design rule check etc.)
• Design for feasibility / manufacturability / Cost - work with substrate suppliers, apply best industry practices to reduce cost and maximize substrate yield and meet industrial design standards such as JEDEC standards.
• Verify new internal design tools and feedback to development team and perform sign off.
• Create design documents and develop training manual.

Essential Attributes:

• Proficient in Cadence Allegro Package Designer (APD) or comparable & AutoCAD experience to design, view, edit or verify designs for optimization iterations and package sign-off.
• Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
• Experience in designs utilizing blind, buried and micro vias would be advantageous.
• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues.
• Good understanding on creating design manual, design rules, generation rules, drawings preparation and documentation.
• Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Moulding, P&P, Ball Attach, Trim & Form, Singulation).
• Strong presentation skills with excellent networking skills.
• Excellent English communication to work with a diverse cross-functional culture.

Qualifications:

• Bachelor or Master Degree in Electrical, Mechanical, or Materials Science Engineering.

Desired Experience Level:

• Minimum 5 to 10 years of experience in semiconductor packaging & substrate designing.