IC Technology Development BOM and Costing Manager

Responsibilities:

• Collect requirements from sales and FAE.
• Perform BOM costing for RFQ to customer.
• Work with SME to collect CAPEX and tooling requirements.
• Collect UPH estimation for costing purpose from SMEs.
• Develop database for BOM costing referencing to speed up cycle time.
• Able to communicate with both internal and external stakeholders.
• Update BOM and co-ordinate with team to implement in SAP system.
  

Essential Attributes:

• Knowledge in wire bond diagram /netlist.
• Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
• Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P, Ball Attach, Trim & Form, Singulation).
• Strong presentation skills with excellent networking skills.
• Excellent English communication to work with a diverse cross-functional culture.
• Willing to tackle tough problems and enjoy problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies.

Qualifications:

• Bachelor Diploma / degree in Mechanical or Materials Science or electronics Engineering.

Desired Experience Level:

• Minimum 3+ years of experience in semiconductor packaging & substrate designing.