Flipchip Engineer

Responsibilities:

• Responsible for the technology and process development for the Flip Chip product packaging engineer.

FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Flux less, Flux Cleaning, Plasma Clean, Underfill and

EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.

• Understand, integrate and innovate to meet customers packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.
• Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
• Offer wide range of BOM selection to cater to different customer requirement.
• Execution of multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.

Essential Attributes:

• Exposure in MS office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
• Passionate in achieving what s not possible via innovation and continuous learning.

Qualifications:

• A minimum relevant engineering or Science degree.

Desired Experience Level:

• Minimum of 4 years of total experience for Sr Engineer and 10 years for Manager.
• Experience in leading a group or team of employees in the achievement of organizational goals.