{"@context":"https://schema.org","@type":"JobPosting","title":"FA / Rel","description":"Key Responsibilities

Imaging using optical microscopes and SEM (Scanning Electron Microscopy) for data curation and failure analysis.
Perform cross-sectioning of semiconductor devices to analyse internal structures and identify failure mechanisms.
Operate C-SAM (C-mode Scanning Acoustic Microscopy) for non-destructive inspection of package integrity.
Perform laser decapsulation and chemical decapsulation to expose die surfaces for failure analysis/data curation.
Conduct routine maintenance of laboratory equipment to ensure optimal performance and accuracy.
Maintain 5S standards in the lab to ensure a clean, organized, and efficient working environment.
Document and report findings clearly and accurately for further review and decision-making.

Qualifications

Bachelor's degree/ Diploma or equivalent in Electronics, Materials Science, or a related field.
Experience as a Failure Analysis Technician or in a similar role within the semiconductor industry is preferred.
Hands-on experience with optical microscopes, SEM, C-SAM, laser decapsulation, and chemical decapsulation is preferred.
Ability to work independently and as part of a team in a fast-paced environment.
Strong communication and documentation skills.

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