Engineer New Product Development (SMT)

Role & responsibilities

• New Product Introduction (NPI): Lead prototype, pilot, and trial production runs on SMT lines. Perform DFM, DFA, and DFT reviews on new PCBA designs.
• Process Setup & Optimization: Establish SMT parameters (stencil design, solder paste printing, 3D SPI, Pick-and-Place setup, reflow profiling, and 3D AOI).
• Tooling & Jigs: Design review SMT selective soldering pallets, and reflow fixtures for complex, high-density designs.
• Quality & APQP: Prepare APQP documentation including PFMEA, Process Flow Charts, Control Plans, SOPs, and ISIR reports.

Defect Analysis & Root Cause:

• Execute 5Why problem-solving and root cause analysis for defects (tombstoning, bridging, voiding, shifting) during trial builds.
• Standards Compliance:
• Ensure strict adherence to IPC-A-610
• Class 3 criteria, ESD/EOS controls, and IATF 16949 / ISO 9001 standards.
• Cross-Functional Coordination:
• Work with R&D, Component Engineering, Sourcing, and Production teams to process ECNs and approve alternate components.

Preferred candidate profile

• Equipment Proficiency: Hands-on experience with high-speed SMT Pick & Place, Screen Printers, Reflow Ovens, 3D SPI, and 3D AOI systems.
• Software Tools: Working knowledge of Gerber viewers, CAD/CAM tools (Valor NPI or Circuit CAM).
• Standards: In-depth knowledge of IPC-A-610, IPC-7351, J-STD-020/033 (MSL handling), and ESD control (ANSI/ESD S20.20).
• Statistical Methods: Proficiency in SPC, yield tracking, and process capability analysis.