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    Job · 13638289

    Qualcomm logo

    Cpu Pdn & Em/Ir Sign-Off Engineer (Lead/Staff)

    Qualcomm · Bengaluru · onsite · Posted 58d ago

    Undisclosed4–9 yrsfulltimeSourced fromNaukri

    About a minute. You'll make an account on the way through.

    About this role

    Company
    Qualcomm India Private Limited
    Job Area
    Engineering Group, Engineering Group > Hardware Engineering
    General Summary
    As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
    Minimum Qualifications
    • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
    • OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
    • OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
    Job Description
    • IR Signoff for CPU/high-performance cores
    • Signal EM Power EM Signoff for chip top level, block level CPU/DSP and other HMs
    • Development of PG Grid spec for different HM
    • Validating the PG Grid using Grid Resistance; Secondary PG Resistance Checks
    • Validating the IR Drops using Static IR, Dynamic IR, Vless VCD Checks for validating Die Pkg Components of IR Drops
    • Experience in IO, Bump planning and RDL routing Strategy
    • Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design
    • Partnering with EDA tool vendors and internal CAD teams to develop and enhance automation flows and methodologies for improving design efficiency
    • Good knowledge on PDN would be desirable
    • Python, Perl, TCL
    Skill Set
    • Hands on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level.
    • Good understanding on Power Integrity Signoff Checks.
    • Proficient in scripting languages (Tcl and Perl).
    • Familiarity with Innovus for RDL / Bump Planning/PG eco.
    • Ability to communicate effectively with multiple global cross-functional teams.
    • Tools : Redhawk, Redhawk_SC and basic use case of Innovus/ Fusion Compiler
    • Power Planning/Floorplanning, Physical Verification hands on experience is added advantage.
    • LSF / compute optimization understanding.
    Education
    • Bachelors - Electronics Engineering
    Work Experiences
    • Years of experience: 4 to 10 years of relevant experience

    Sourced from naukri

    Skills

    ScriptingSOCPower IntegrityHardware Engineeringmechanical systemsInnovuscompilerscripting languagesAnalogLsfPerlCADElectronics EngineeringHMSPythonDigital TransformationPhysical VerificationRest Assured

    About Qualcomm

    Qualcomm logo

    Qualcomm

    Semiconductors

    22k+

    employees

    1996

    30 years old

    San Diego,California

    United States

    About

    Qualcomm invents breakthrough technologies that transform how the world connects, computes and communicates.

    Industries

    SemiconductorsHardware & Networking

    Employee ratings

    1,207 reviews

    3.7/ 5

    Culture

    3.4

    Career growth

    3.2

    Work-life

    3.3

    Employees rate it well for

    Work Life Balance267Salary160Work Culture155Learning100Senior Management91

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