BSP Engineer

Experience: 4+ years relevant (5–8 years overall) Education: B.E. / B.Tech / M.Tech in Electronics, Electrical, Computer Science or related field Domain: Automotive Embedded Systems

We are looking for a BSP Engineer to bring up and maintain Linux and Android platforms on automotive-grade SoCs and custom boards. You will own the stack from bootloader and kernel through Yocto and AOSP integration, working closely with hardware, middleware and validation teams.

• Perform board bring-up, hardware validation and platform initialization for new automotive SoCs and custom boards.
• Develop, port and maintain U-Boot / bootloader for target hardware.
• Configure and maintain Device Tree (DTS/DTSI) files for SoC and peripheral configuration.
• Enable and validate peripherals: UART, I2C, SPI, CAN, USB, PCIe, MIPI CSI/DSI, HDMI, Ethernet, eMMC, UFS.

• Port and customize Linux Kernel (v5.x / v6.x) for automotive hardware.
• Develop, debug and maintain kernel drivers for automotive-specific components.
• Integrate the BSP with Yocto / OpenEmbedded: recipes, layers and meta-layers.
• Optimize boot time and power management (suspend/resume, DVFS).

• Port and customize AOSP for automotive SoCs (Qualcomm SA-series, NXP i.MX, Renesas R-Car, TI TDA, Telechips TCC803x / TCC835x).
• Manage the Android build system (Soong / Make), AOSP manifest and vendor integrations.
• Support Android OTA updates (A/B partitioning, Virtual A/B).
• Debug using Logcat, ADB, systrace, Perfetto, bugreport and KGDB.

• Apply awareness of functional safety standard ISO 26262 (ASIL A/B/C/D).
• Ensure MISRA C/C++ compliance where applicable.

• Strong C / C++ programming.
• Linux kernel internals: memory management, scheduling, driver model.
• Yocto Project / OpenEmbedded.
• Git, repo and Gerrit workflows.
• JTAG debugging; use of oscilloscopes and logic analyzers.
• ARM architecture (Cortex-A / M / R).
• U-Boot or other bootloaders (GRUB, Trusted Firmware-A).

• Android Automotive OS (AAOS) / Android Auto.
• Hypervisor / virtualization: Xen, KVM, QNX Hypervisor.
• Automotive SoC platforms: Qualcomm SA8xxx, NXP S32G / i.MX8, Renesas R-Car H3/M3, TI TDA4VM, Telechips TCC803x / TCC835x.
• A-SPICE process knowledge.
• Agile / SCRUM methodology.

Primary: C, C++, BSP, Board Bring-up, Embedded Linux, Linux Kernel, Device Drivers, Device Tree, U-Boot, Bootloader, Yocto, OpenEmbedded, AOSP, Android BSP, ARM Cortex, UART, I2C, SPI, CAN, USB, PCIe, MIPI CSI/DSI, HDMI, Ethernet, eMMC, UFS, JTAG, KGDB, Git, Gerrit

Secondary: AAOS, Android OTA, A/B Partitioning, Logcat, ADB, Perfetto, Hypervisor (Xen, KVM, QNX), Qualcomm SA8xxx, NXP i.MX8/S32G, Renesas R-Car, TI TDA4VM, Telechips TCC803x/835x, Power Management, DVFS, ISO 26262, ASIL, MISRA, A-SPICE, Agile/SCRUM