ASIC Engineer

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received

Cisco s Client Optics Group (COG) designs delivers the high-speed optical transceivers, and platforms that power Ciscos core data center networking solutions. We specialize in the design and integration of cutting-edge IM/DD optics and silicon photonic platforms that enable customers to deploy industry-leading optical technologies within data center with unprecedented speed, capacity, and reliability. Come join us and take part in shaping COG s ground-breaking optical solutions by designing, developing, and testing some of the most advanced pluggable, and Co-packaged Optics (CPO) being developed in the industry.

You will work with Ciscos outstanding Silicon Photonics team. Our team is responsible for driving the development and optimization of optical transceivers modules (800G,1.6T beyond) that seamlessly integrate with Ciscos routing, switching, and datacenter platforms, enabling customers to build scalable, high-performance networks that support emerging technologies including AI/ML workloads, and next-generation data center architectures.

We are looking for a talented and experienced Digital Design Engineer to join the Silicon One Optics Group (S1O) Digital Design Team and drive the digital design and integration of Cisco s silicon photonics integrated circuits for next generation 100G, 200G, and 400G per lambda solutions.

In this role, you will own RTL design, and subsystem integration of digital logic used in high-performance optical interconnect products. You will work closely with analog/mixed-signal designers, verification engineers, physical design, DFT, firmware, packaging, process, and product engineering teams to develop robust, high-quality, and manufacturable designs that meet performance, power, reliability, and production requirements.

With a strong understanding of digital systems, RTL development, mixed-signal integration, ASIC/SoC design flow, and implementation readiness, you will participate in all phases of digital design from concept through tapeout and production support. You will drive block-level digital development for control functions, interfaces, receive/transmit paths, and integrated high-speed interface circuitry within a silicon photonics module, CPO (Co-Packaged Optics) engine.

Specific responsibilities include:

As a Digital Design Engineer, you will work with a diverse team of engineers spanning digital design, analog/mixed-signal design, verification, DFT, physical design, firmware, FPGA, CAD, packaging, and post-silicon validation.

At the concept stage, you will participate in the digital architecture, interface requirements, implementation strategy, and design methodology. During execution, you will write block-level RTL and support full-chip integration of high-speed IPs such as ODSP, D2D IP, SerDes XSR, SerDes PAM4 integrated drivers/TIA, and control functions. You will work closely with verification teams to ensure complete functional closure, with physical design teams to support implementation readiness, and with post-silicon teams to help drive successful product bring-up and release to production.